It has been confirmed by passing a PCB with fitted thermocouples through the oven - Research indicated that this can be caused by initial temperature ramp being too steep but adjusting this setting did not make any discernible difference - Humidity was around 60% on the day but we've found similar results earlier this week on days with low humidity I've contacted Chipquick but yet to have a response from them so thought I'd check if the knowledgeable people here have any suggestions what might be happening. After some tests I also realized another problem: I didnt want to spend too much money on the cadence sensor until I was sure that what I was aiming for was. Daily replacement with a fresh syringe of paste can prolong ejector life and optimize performance. From +4° to +6° C (40° - 42° F) this will take approximately 4 hours. From -18° C (0° F) this will take approximately 12 hours. The paste was purchased from Digikey with a date code of this year - The paste was brought to room temperature and well mixed before use - Paste was applied using a stencil but components were placed by hand, so it was a few hours before entering the oven - The reflow profile has been set as per the solder paste datasheet. Allow the solder paste to warm up completely and naturally to ambient temperature prior to use. I like AIM M8 more because its less nasty and flows better. We chose Chipquick because it's supposed to have a very long shelf life and is less fussy about storage (even though we keep it refrigerated). The reflow profile has been set as per the solder paste datasheet. We tried it with our little prototyping batch oven and had the same results. filled with solder paste and then soldered using the reflow soldering. We've been trying out Chipquick TS391AX250 solder paste while commissioning our new conveyor reflow oven (as part of our new SMT line) but we're having lots of issues with tiny solder balls suspended in the flux residue post reflow. Signal M8, solder connection, PCB mounting.
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